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Response surface methodology: a modeling tool for integrated circuit designers
An approach to design is described which allows the designer to statistically analyze a circuit's output characteristics. The results of this analysis give the designer the ability to reduce the sensitivity and to optimize these output characteristics with respect to process, package, and envir...
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Published in: | IEEE journal of solid-state circuits 1989-04, Vol.24 (2), p.469-473 |
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Main Authors: | , , , |
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Language: | English |
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cited_by | cdi_FETCH-LOGICAL-c272t-9926a04796fb02be887035cc4bab2de85208e907d01a396610909b58eecb615e3 |
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cites | cdi_FETCH-LOGICAL-c272t-9926a04796fb02be887035cc4bab2de85208e907d01a396610909b58eecb615e3 |
container_end_page | 473 |
container_issue | 2 |
container_start_page | 469 |
container_title | IEEE journal of solid-state circuits |
container_volume | 24 |
creator | McDonald, J. Maini, R. Spangler, L. Weed, H. |
description | An approach to design is described which allows the designer to statistically analyze a circuit's output characteristics. The results of this analysis give the designer the ability to reduce the sensitivity and to optimize these output characteristics with respect to process, package, and environmental variations. In addition, the authors demonstrate the means by which to establish output specifications before time and money are invested in fabricating devices in silicon. Finally, examples of the successful application of this technique to the design and development of an ECL (emitter-coupled logic) family are discussed. The methods for applying the results from this statistical technique to manufacturing and testing are also shown.< > |
doi_str_mv | 10.1109/4.18611 |
format | article |
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ispartof | IEEE journal of solid-state circuits, 1989-04, Vol.24 (2), p.469-473 |
issn | 0018-9200 1558-173X |
language | eng |
recordid | cdi_crossref_primary_10_1109_4_18611 |
source | IEEE Electronic Library (IEL) Journals |
subjects | Circuit simulation Equations Input variables Integrated circuit modeling Mathematical model Packaging Polynomials Power supplies Response surface methodology Temperature |
title | Response surface methodology: a modeling tool for integrated circuit designers |
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