Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasers

Recent advances in semiconductor laser technology, specifically the emergence of vertical cavity surface emitting lasers (VCSELs), have created room for substantial improvements in the performance of low-cost, fiber-optic links. However, traditional electronic packaging of the VCSELs and detectors s...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2000-02, Vol.23 (1), p.42-54
Main Authors: Fokken, G.J., Walters, W.L., Mattson, L.F., Gilbert, B.K.
Format: Article
Language:English
Subjects:
Applied sciences
Circuit properties
Design. Technologies. Operation analysis. Testing
Detectors
Electric, optical and optoelectronic circuits
Electronics
Electronics packaging
Exact sciences and technology
Fiber lasers
Integrated circuits
Integrated optics. Optical fibers and wave guides
Integrated optoelectronics. Optoelectronic circuits
Laboratories
Laser modes
Lasers
Links
Mathematical models
Microelectronic fabrication (materials and surfaces technology)
Optical and optoelectronic circuits
Optical fiber devices
Optical fibers
Packages
Packaging
Semiconductor device packaging
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductor lasers
Surface emitting lasers
Vertical cavity surface emission lasers
Vertical cavity surface emitting lasers
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Description
Summary:Recent advances in semiconductor laser technology, specifically the emergence of vertical cavity surface emitting lasers (VCSELs), have created room for substantial improvements in the performance of low-cost, fiber-optic links. However, traditional electronic packaging of the VCSELs and detectors severely limits the performance of these new devices. In two previous papers from this laboratory [1996, 1997], traditional laser packages were described, modeled, measured and evaluated. Further, a new improved conceptual package, referred to as the optical package for advanced lasers (OPAL), was presented, as were a set of design guidelines for a new generation of packages for VCSELs and detectors. This paper, describing a continuation of the previous work, discusses the design, modeling, fabrication, and demonstration of OPALs in a laboratory environment. Measured results recorded from VCSELs packaged in OPALs operating to 5 Gbit/s data rates are presented.
ISSN:1521-3323
1557-9980
DOI:10.1109/6040.826761