Hybrid integration of surface-emitting microlaser chip and planar optics substrate for interconnection applications

The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m....

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Bibliographic Details
Published in:IEEE photonics technology letters 1992-12, Vol.4 (12), p.1369-1372
Main Authors: Jahns, J., Morgan, R.A., Nguyen, H.N., Walker, J.A., Walker, S.J., Wong, Y.M.
Format: Article
Language:English
Subjects:
Applied sciences
Bandwidth
Bonding
Circuit properties
Circuit simulation
Detectors
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Gallium arsenide
Integrated circuit interconnections
Integrated optics
Optical and optoelectronic circuits
Optical interconnections
P-i-n diodes
PIN photodiodes
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Summary:The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.< >
ISSN:1041-1135
1941-0174
DOI:10.1109/68.180579