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Adhesion enhancement and lamination of polyimide films

Fully imidized polyimide films were joined together in a lamination process to form a structure that is flexible and has superior thermal stability. This process was demonstrated using the commercially available films KaptonH and UpilexS, as well as spuncast and thermally imidized pyromellitic dianh...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1996-05, Vol.19 (2), p.417-422
Main Authors: Stoffel, N.C., Hsieh, M., Kramer, E.J., Volksen, W.
Format: Article
Language:English
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Summary:Fully imidized polyimide films were joined together in a lamination process to form a structure that is flexible and has superior thermal stability. This process was demonstrated using the commercially available films KaptonH and UpilexS, as well as spuncast and thermally imidized pyromellitic dianhydride/4-amino phenyl ether (PMDA-ODA) films. When any of these films without prior surface treatment, were placed together and laminated, the interface was very weak, always with a fracture energy G/sub c/
ISSN:1070-9894
1558-3686
DOI:10.1109/96.496046