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Adhesion enhancement and lamination of polyimide films
Fully imidized polyimide films were joined together in a lamination process to form a structure that is flexible and has superior thermal stability. This process was demonstrated using the commercially available films KaptonH and UpilexS, as well as spuncast and thermally imidized pyromellitic dianh...
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Published in: | IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging packaging, and manufacturing technology. Part B, Advanced packaging, 1996-05, Vol.19 (2), p.417-422 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Fully imidized polyimide films were joined together in a lamination process to form a structure that is flexible and has superior thermal stability. This process was demonstrated using the commercially available films KaptonH and UpilexS, as well as spuncast and thermally imidized pyromellitic dianhydride/4-amino phenyl ether (PMDA-ODA) films. When any of these films without prior surface treatment, were placed together and laminated, the interface was very weak, always with a fracture energy G/sub c/ |
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ISSN: | 1070-9894 1558-3686 |
DOI: | 10.1109/96.496046 |