A Large Area Flexible Array Sensors Using Screen Printing Technology

A flexible electronics sensor for large area sensing was developed using a screen printing technology with the thixotropy sol-gel materials to form the microstructure patterns on two polyimide (PI) sheets. A flexible sensor is 150times150 mm 2 , including posts, resistances, bumps, and electrode tra...

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Bibliographic Details
Published in:Journal of display technology 2009-06, Vol.5 (6), p.178-183
Main Authors: Chang, Wen-Yang, Fang, Te-Hua, Lin, Heng-Ju, Shen, Yu-Tang, Lin, Yu-Cheng
Format: Article
Language:English
Subjects:
array sensor
Arrays
Biomembranes
bump
Detection
Electrodes
Electronics
Flexible electronics
Microstructure
multi-scanning
Polyimide resins
Polyimides
Printing
resistance
Screen printing
Sensor arrays
Sensors
Sheet materials
Space technology
Stress
tactile
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Summary:A flexible electronics sensor for large area sensing was developed using a screen printing technology with the thixotropy sol-gel materials to form the microstructure patterns on two polyimide (PI) sheets. A flexible sensor is 150times150 mm 2 , including posts, resistances, bumps, and electrode traces. The space between the top electrode and the resistance layer provided a buffer distance for large bending. Experimental results show that array microstructures have good morphological profiles at a screen speed of 10 mm/s, a squeegee pressure of 213 kPa, and a separation speed of 0.4 mm/s using the print-print mode. A membrane with a bump protrusion had a large displacement and a quick sensitive response because the bump provided a concentrated force of von Mises stress on the membrane center. For printing thick structures, diffusion effects and dimensional shrinkages can be reduced when a paste material with a higher viscosity is used. The results exhibit a potential for using in the flexible sensing and higher temperatures. In additional, the fabrication is the low cost and potential higher throughput in flexible electronics applications.
ISSN:1551-319X
1558-9323
DOI:10.1109/JDT.2008.2004862