Design and Optimization Techniques of Over-Chip Bond-Wire Microtransformers With LTCC Core

This paper describes the realization of bond-wire micromagnetics by using standard bonding wires and a toroidal ferromagnetic low-temperature co-fired ceramic core with high resistivity. The proposed fabrication procedure is suitable for the development of magnetic components on the top of an integr...

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Bibliographic Details
Published in:IEEE journal of emerging and selected topics in power electronics 2018-06, Vol.6 (2), p.592-603
Main Authors: Camarda, Antonio, Macrelli, Enrico, Paganelli, Rudi Paolo, Tartagni, Marco, Roy, Saibal, Romani, Aldo
Format: Article
Language:English
Subjects:
Bonding wire
ferrite
harvesting
Inductance
low-temperature co-fired ceramic (LTCC)
Magnetic cores
magnetic transformer
on-chip
over chip
power supply in package (PwrSiP)
power supply on chip (PwrSoC)
Soft magnetic materials
System-on-chip
Toroidal magnetic fields
Wires
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Description
Summary:This paper describes the realization of bond-wire micromagnetics by using standard bonding wires and a toroidal ferromagnetic low-temperature co-fired ceramic core with high resistivity. The proposed fabrication procedure is suitable for the development of magnetic components on the top of an integrated circuit with a small profile and a small size (
ISSN:2168-6777
2168-6785
DOI:10.1109/JESTPE.2017.2751745