Overlap optimization in semiconductor waveguides by wafer bonding

In this work, we show that the use of a wafer-bonding technique, wherein an inverted half-waveguide structure is bonded on the upright half to form a complete waveguide, optimizes the overlap factor present in three-wave parametric interactions realized in 43m semiconductor waveguides. These optimiz...

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Bibliographic Details
Published in:IEEE journal of quantum electronics 2003-06, Vol.39 (6), p.787-792
Main Authors: Munoz, M., Patel, N.B.
Format: Article
Language:English
Subjects:
Applied sciences
Bonding
Circuit properties
Devices
Electric, optical and optoelectronic circuits
Electromagnetic waveguides
Electronics
Emittance
Exact sciences and technology
Infrared
Infrared detectors
Integrated optics. Optical fibers and wave guides
Laboratories
Magnetic materials
Nonlinear waveguides
Optical and optoelectronic circuits
Optical frequency conversion
Optical waveguides
Optimization
Partial differential equations
Quantum electronics
Semiconductor materials
Semiconductor waveguides
Semiconductors
Wafer bonding
Waveguides
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Description
Summary:In this work, we show that the use of a wafer-bonding technique, wherein an inverted half-waveguide structure is bonded on the upright half to form a complete waveguide, optimizes the overlap factor present in three-wave parametric interactions realized in 43m semiconductor waveguides. These optimized waveguides can be used for efficient frequency-mixing devices which detect or emit infrared light.
ISSN:0018-9197
1558-1713
DOI:10.1109/JQE.2003.810772