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Integration Trends in Monolithic Power ICs: Application and Technology Challenges

This paper highlights the general trend towards further monolithic integration in power applications by enabling power management and interfacing solutions in advanced CMOS nodes. The need to combine high-density digital circuits, power-management circuits, and robust interfaces in a single technolo...

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Published in:IEEE journal of solid-state circuits 2016-09, Vol.51 (9), p.1965-1974
Main Authors: Rose, Matthias, Bergveld, Henk Jan
Format: Article
Language:English
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cited_by cdi_FETCH-LOGICAL-c293t-e9c7f6359f3545e1a918104882b8ac30634977f6aff09183bb2a9b40fb49c00d3
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container_end_page 1974
container_issue 9
container_start_page 1965
container_title IEEE journal of solid-state circuits
container_volume 51
creator Rose, Matthias
Bergveld, Henk Jan
description This paper highlights the general trend towards further monolithic integration in power applications by enabling power management and interfacing solutions in advanced CMOS nodes. The need to combine high-density digital circuits, power-management circuits, and robust interfaces in a single technology platform requires the development of additional process options on top of baseline CMOS. Examples include high-voltage devices, devices to enable area-efficient ESD protection, and integrated capacitors and inductors with high quality factors. The use of bipolar devices in these technologies for protection and control purposes in power applications is also addressed.
doi_str_mv 10.1109/JSSC.2016.2566612
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source IEEE Electronic Library (IEL) Journals
subjects Batteries
BCD technology
CMOS integrated circuits
CMOS technology
DC/DC converter
ESD protection
high-voltage devices
integrated passives
interfaces
Logic gates
Monolithic integrated circuits
monolithic integration
power management
Sensors
Transistors
title Integration Trends in Monolithic Power ICs: Application and Technology Challenges
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