Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision

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Bibliographic Details
Published in:IEEE journal of selected topics in quantum electronics 2022, p.1-11
Main Authors: Marinins, Aleksandrs, Hansch, Sebastian, Sar, Huseyin, Chancerel, Francois, Golshani, Negin, Wang, Hsiao-Lun, Tsiara, Artemisia, Coenen, David, Verheyen, Peter, Capuz, Giovanni, De Koninck, Yannick, Yilmaz, Ozan, Morthier, Geert, Schleicher, Filip, Jamieson, Geraldine, Smyth, Stuart, McKee, Andrew, Ban, Yoojin, Pantouvaki, Marianna, La Tulipe, Douglas Charles, Van Campenhout, Joris
Format: Article
Language:English
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ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2022.3223641