Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect

In this letter, the Resistance Inductance Capacitance Conductance (RLCG) parameters of carbon nanotube through silicon via (CNT-TSV) are modeled and a transmission line (TL) model is established through ABCD matrix. The impact of their geometrical and material parameters on the TSV transmission char...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2014-12, Vol.24 (12), p.830-832
Main Authors: Qian, Libo, Zhu, Zhangming, Xia, Yinshui
Format: Article
Language:English
Subjects:
Air gap
Air gaps
Capacitance
Carbon nanotubes
CNT-TSV
Impact analysis
Inductance
Insertion loss
Integrated circuit interconnections
Mathematical models
Reduction
Resistance
signal loss
Silicon
Through-silicon vias
transmission characteristics
Transmission lines
Wideband
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Summary:In this letter, the Resistance Inductance Capacitance Conductance (RLCG) parameters of carbon nanotube through silicon via (CNT-TSV) are modeled and a transmission line (TL) model is established through ABCD matrix. The impact of their geometrical and material parameters on the TSV transmission characteristics is analyzed over a wideband of frequency using the proposed model. An optimization methodology using air gap insulator is proposed to improve the transmission performance. SPICE results show that a 30.83% reduction in insertion loss and a 40.72% increase in eye open area, respectively.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2014.2361429