RF Interconnections for Paper Electronics

Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the p...

Full description

Saved in:
Bibliographic Details
Published in:IEEE microwave and wireless components letters 2015-10, Vol.25 (10), p.684-686
Main Authors: Xie, Li, Feng, Yi, Yang, Geng, Chen, Qiang, Zheng, Li-Rong
Format: Article
Language:English
Subjects:
Attenuation
Capacitive coupling
Coplanar waveguides
inkjet printing
Integrated circuit interconnections
Organic electronics
paper electronics
Radio frequency
RF interconnection
Substrates
Transmission line measurements
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Low temperature and the fragility features of paper substrate require novel approach for the heterogeneous integration of silicon chip and printed components. In this letter, RF interconnection via capacitive coupling is proposed for printed paper electronics. Capacitive coupling combined with the printed transmission line is used as the signal channel and realizes chip-to-chip communication. Modulation such as orthogonal frequency-division multiplexing is used for multiple chips to share the same transmission channel and increase the data rate. The channel response of the RF interconnection is studied and the feasibility is evaluated.
ISSN:1531-1309
2771-957X
1558-1764
1558-1764
2771-9588
DOI:10.1109/LMWC.2015.2468572