Accurate Electromagnetic Analysis of Interconnect Structures Based on a Mixed Method

Accurate electromagnetic (EM) analysis for interconnect structures of integrated circuits is challenging because multicomponent materials and multiscale geometry coexist and they will greatly deteriorate the conditioning of system matrix in the integral equation approach. We use the volume-surface i...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2020-08, Vol.30 (8), p.733-736
Main Authors: He, Yuan, Tong, Mei Song
Format: Article
Language:English
Subjects:
Conditioning
Current density
Geometry
Integral equations
Integrated circuits
interconnect structure
Media
Method of moments
Mixed method
Mixed methods research
multiscale
Permittivity
Substrates
Volume integral equations
volume-surface integral equation (VSIE)
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Summary:Accurate electromagnetic (EM) analysis for interconnect structures of integrated circuits is challenging because multicomponent materials and multiscale geometry coexist and they will greatly deteriorate the conditioning of system matrix in the integral equation approach. We use the volume-surface integral equations (VSIEs) to describe the problem and develop a mixed method to solve the VSIEs. The involved volume integral equations (VIEs) can improve the conditioning of system matrix, whereas the mixed method can remove the dependence of material parameters in the integral kernel of VIEs. The approach is demonstrated by two numerical examples and its good performance has been validated.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2020.3008494