Quarter-Micron Alignment of Chiplets via Positive Self-Aligned Structures

A simple self-aligning methodology is demonstrated for the accurate placement of chiplets on a substrate die. This approach is enabled by the registration of reflowed polymer domes both on the substrate and on the chiplet. Using flip-chip bonding, quarter-micron alignment accuracy is proposed and de...

Full description

Saved in:
Bibliographic Details
Published in:IEEE photonics technology letters 2023-11, Vol.35 (21), p.1-1
Main Authors: Yu, Shengtao, Gaylord, Thomas K., Bakir, Muhannad S.
Format: Article
Language:English
Subjects:
chiplets arrays
Couplings
Glass substrates
Optical fiber couplers
Optical fibers
Optical interconnections
passive alignment
Resists
Self alignment
Silicon
Silicon substrates
Substrates
Vertical separation
Citations: Items that this one cites
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A simple self-aligning methodology is demonstrated for the accurate placement of chiplets on a substrate die. This approach is enabled by the registration of reflowed polymer domes both on the substrate and on the chiplet. Using flip-chip bonding, quarter-micron alignment accuracy is proposed and demonstrated on both Si and glass substrates. The vertical separation between chiplet and die is tailorable depending on the application. This methodology provides a potential building block for co-packaged optics.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2023.3308058