High frequency measurement techniques for vias in printed circuit boards

This article provides an overview of some multiport measurement techniques for dense via arrays, which play an important role in high-speed links as package and connector footprints in multilayer printed circuit boards. Advantages, challenges, and limitations of three approaches for high-frequency m...

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Bibliographic Details
Published in:IEEE electromagnetic compatibility magazine 2014-01, Vol.3 (4), p.104-113
Main Authors: Kotzev, Miroslav, Kwark, Young H., Muller, Sebastian, Hardock, Andreas, Rimolo-Donadio, Renato, Baks, Christian, Schuster, Christian
Format: Article
Language:English
Subjects:
Measurement techniques
Microprobes
Network analyzers
parallel plates
Power system reliability
printed circuit board
Printed circuit boards
Printed circuits
Probes
RF microprobes
signal and power integrity
Test equipment
two-tier calibration
vector network analyzer
Vectors
vias
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Summary:This article provides an overview of some multiport measurement techniques for dense via arrays, which play an important role in high-speed links as package and connector footprints in multilayer printed circuit boards. Advantages, challenges, and limitations of three approaches for high-frequency measurements up to 50 GHz are discussed: launches with fan-out traces and on-board coaxial connectors, double-sided direct surface probing with RF microprobes, and recessed probe launches with extension traces and microprobes. The measurement results obtained by the presented measurement techniques are then compared to simulation results computed using full-wave and physics-based via models. Finally, the multiport probing approach with interposers is addressed through a case study of simultaneous access for up to 12 vias in a 1 mm pitch via array that can be applied for measurements in the frequency range up to 10 - 15 GHz.
ISSN:2162-2264
2162-2272
DOI:10.1109/MEMC.2014.7023212