Beyond Wires: The Future of Interconnects

This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.

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Bibliographic Details
Published in:IEEE MICRO 2024-03, Vol.44 (2), p.4-5
Main Author: Lee, Hsien-Hsin S.
Format: Article
Language:English
Subjects:
Interconnections
Online Access:Get full text
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Description
Summary:This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.
ISSN:0272-1732
1937-4143
DOI:10.1109/MM.2024.3373336