Beyond Wires: The Future of Interconnects

This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.

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Published in:IEEE MICRO 2024-03, Vol.44 (2), p.4-5
Main Author: Lee, Hsien-Hsin S.
Format: Article
Language:English
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Interconnections
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description This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.
doi_str_mv 10.1109/MM.2024.3373336
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title Beyond Wires: The Future of Interconnects
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