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Critical temperature of niobium and tantalum films

A method for depositing thin, superconductive films of Nb and Ta by electron beam evaporation is presented, and the critical temperature of these films is discussed as a function of deposition conditions. Gettering, increasing the ratio of impinging vapor atoms to residual gas atoms, and raising the...

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Published in:Proceedings of the IEEE 1964-10, Vol.52 (10), p.1234-1238
Main Authors: Rairden, J.R., Neugebauer, C.A.
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Language:English
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description A method for depositing thin, superconductive films of Nb and Ta by electron beam evaporation is presented, and the critical temperature of these films is discussed as a function of deposition conditions. Gettering, increasing the ratio of impinging vapor atoms to residual gas atoms, and raising the substrate temperature during deposition gives films with a lower impurity content and higher critical temperature. The resistance ratio of a film and its x-ray lattice parameter are taken as measures of its average impurity concentration. Critical temperatures above 9°K are measured for Nb films of resistance ratio of 3 or higher, and critical temperatures above 4.2°K are measured for Ta films of resistance ratio of 5 or higher.
doi_str_mv 10.1109/PROC.1964.3311
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source IEEE Electronic Library (IEL) Journals
subjects Atomic layer deposition
Atomic measurements
Electrical resistance measurement
Electron beams
Gettering
Impurities
Niobium
Superconducting films
Superconductivity
Temperature
title Critical temperature of niobium and tantalum films
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