Polymer Optical Interconnects-A Scalable Large-Area Panel Processing Approach

• Published in: IEEE transactions on advanced packaging 2006-02, Vol.29 (1), p.158-170
• Main Authors: Uhlig, S., Frohlich, L., Chen, M., Arndt-Staufenbiel, N., Lang, G., Schroder, H., Houbertz, R., Popall, M., Robertsson, M.
• Format: Article
• Language: English
• Subjects: Applied sciences; Backplanes; Circuit properties; Electric, optical and optoelectronic circuits; Electronics; Exact sciences and technology; Flexible manufacturing approach; Hybrid polymers; Integrated optics. Optical fibers and wave guides; Large-area processing; Lithography; Microelectronic fabrication (materials and surfaces technology); Miscellaneous; Optical and optoelectronic circuits; Optical backplane; Optical interconnect review; Optical interconnections; Optical interconnects; Optical mixing; Optical polymers; Optical refraction; Optical variables control; Optical waveguides; ORMOCER; Panels; Planes; Polymer optical waveguide; Projection; Projection UV lithogaphy; Routing; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Silicon substrates; TECHNOLOGY; TEKNIKVETENSKAP; Tiles; Waveguides
• ISSN: 1521-3323; 1557-9980; 1557-9980
• DOI: 10.1109/TADVP.2005.849555

A flexible approach to producing optical interconnects on 609.6 ast , 609.6 mm large-area panels is demonstrated. Stepwise projection patterning from 101.6 ast , 101.6 mm masks has generated optical waveguide patterns over the whole panel using large-area projection lithography equipment. The waveguide routing design allows optical waveguides on different 101.6 ast , 101.6 mm tiles to be interconnected. Four different waveguide connecting geometries in the border region between tiles have been fabricated and tested. Multimode waveguides from inorganic-organic hybrid polymers (ORMOCER) (cross section: le hbox 50~muhbox mast hbox 10~muhbox m ) with refractive index step between core and cladding Delta n=hbox 0.01 were produced. The index step was adjusted by mixing two diffrent ORMOCER systems. The materials show good adhesion to numerous substrates, such as glass and silicon. Application concepts such as flexible manufacturing of optoelectrical hybrid backplanes with two-dimensional interconnect, a three-dimensional optical interconnect with optical vias, and a hybrid backplane with the optical interconnect in a strip-format on a separate plane right above the electrical plane are proposed. Promising new technologies are presented along with preliminary demonstrativ viability.