Inductive and Capacitive Coupling Noise in Superconductive VLSI Circuits

The increasing complexity of modern superconductive circuits, and single flux quantum (SFQ) circuits in particular, has made the issue of coupling noise of growing importance. Limited metal resources within superconductive circuits have exacerbated this issue. In this article, the different sources...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2023-12, Vol.33 (9), p.1-7
Main Authors: Jabbari, Tahereh, Friedman, Eby G.
Format: Article
Language:English
Subjects:
Automated layout
Circuits
Complexity
coupling noise
Couplings
Dielectrics
electronic design automation (EDA)
Inductance
Inductive coupling
Inductors
Performance degradation
Stripline
Striplines
superconductive integrated circuits
Superconductivity
Superconductors
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The increasing complexity of modern superconductive circuits, and single flux quantum (SFQ) circuits in particular, has made the issue of coupling noise of growing importance. Limited metal resources within superconductive circuits have exacerbated this issue. In this article, the different sources of coupling noise within SFQ circuits are described. Coupling noise among inductors, routing striplines, and bias microstriplines within SFQ circuits degrade performance while decreasing margins. In this article, inductive and capacitive coupling between the different layers are characterized. Inductive coupling models between different layers in the MIT LL SFQ5ee process match experimental data within 3%. The dependence of inductive coupling on the thickness of the oxide and metal layer is also discussed. An understanding of inductive and capacitive coupling can determine the minimum physical distance between lines. In addition, tradeoffs exist among inductive coupling, capacitive coupling, layout complexity, and the vias between ground layers. The different coupling sources are characterized, and guidelines are provided to enhance the automated routing process.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2023.3320885