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Transient temperature fields with general nonlinear boundary conditions in electronic systems
Green's function representations of the solution of the heat conduction equation for general boundary conditions are generalized for the nonlinear, i.e., temperature dependent case. Temperature dependent heat transfer coefficients lead to additional terms in the Green's function representa...
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Published in: | IEEE transactions on components and packaging technologies 2005-03, Vol.28 (1), p.23-33 |
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description | Green's function representations of the solution of the heat conduction equation for general boundary conditions are generalized for the nonlinear, i.e., temperature dependent case. Temperature dependent heat transfer coefficients lead to additional terms in the Green's function representation of the temperature field. For a rectangular structure with averaged homogeneous material parameters several types of Green's functions can be chosen especially simple, because of the new representation with the possibility of differing types of boundary conditions for the temperature field and the Green's function. Exact finite closed form expressions for three-dimensional-Green's functions in the time domain using elliptic theta functions are presented. The temperature field is a solution of a nonlinear integral equation which is solved numerically by iteration. The resulting algorithm is very robust, stable and accurate with reliable convergence properties and avoids matrix inversions completely. The algorithm can deal with all sizes of volume heat sources without additional grid generation. Large and small size volume heat sources are treated simultaneously in the calculations that will be presented. Heat transfer coefficients are chosen representing radiative and convective boundary conditions. An extension of the solution algorithm to composed multilayer systems of arbitrary geometry is outlined. |
doi_str_mv | 10.1109/TCAPT.2004.843186 |
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Temperature dependent heat transfer coefficients lead to additional terms in the Green's function representation of the temperature field. For a rectangular structure with averaged homogeneous material parameters several types of Green's functions can be chosen especially simple, because of the new representation with the possibility of differing types of boundary conditions for the temperature field and the Green's function. Exact finite closed form expressions for three-dimensional-Green's functions in the time domain using elliptic theta functions are presented. The temperature field is a solution of a nonlinear integral equation which is solved numerically by iteration. The resulting algorithm is very robust, stable and accurate with reliable convergence properties and avoids matrix inversions completely. The algorithm can deal with all sizes of volume heat sources without additional grid generation. Large and small size volume heat sources are treated simultaneously in the calculations that will be presented. Heat transfer coefficients are chosen representing radiative and convective boundary conditions. An extension of the solution algorithm to composed multilayer systems of arbitrary geometry is outlined.</description><identifier>ISSN: 1521-3331</identifier><identifier>EISSN: 1557-9972</identifier><identifier>DOI: 10.1109/TCAPT.2004.843186</identifier><identifier>CODEN: ITCPFB</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Algorithms ; Boundary conditions ; Conducting materials ; Green's function methods ; Green's functions ; Heat transfer ; Integral equations ; Mathematical analysis ; Mathematical models ; Mesh generation ; Multi-chip-modules (MCMs) ; Nonhomogeneous media ; Nonlinear equations ; nonlinear heat conduction with Green's function method ; Nonlinearity ; radiative and convective boundary conditions ; Representations ; Robustness ; Studies ; Temperature dependence ; Temperature distribution ; thermal transient modeling</subject><ispartof>IEEE transactions on components and packaging technologies, 2005-03, Vol.28 (1), p.23-33</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2005</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c355t-f432f966c48432fa8e88938a5b60737783ca4cdc16efb6f6244b00422b85f6383</citedby><cites>FETCH-LOGICAL-c355t-f432f966c48432fa8e88938a5b60737783ca4cdc16efb6f6244b00422b85f6383</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1402608$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,27903,27904,54775</link.rule.ids></links><search><creatorcontrib>Gerstenmaier, Y.C.</creatorcontrib><creatorcontrib>Wachutka, G.K.M.</creatorcontrib><title>Transient temperature fields with general nonlinear boundary conditions in electronic systems</title><title>IEEE transactions on components and packaging technologies</title><addtitle>TCAPT</addtitle><description>Green's function representations of the solution of the heat conduction equation for general boundary conditions are generalized for the nonlinear, i.e., temperature dependent case. Temperature dependent heat transfer coefficients lead to additional terms in the Green's function representation of the temperature field. For a rectangular structure with averaged homogeneous material parameters several types of Green's functions can be chosen especially simple, because of the new representation with the possibility of differing types of boundary conditions for the temperature field and the Green's function. Exact finite closed form expressions for three-dimensional-Green's functions in the time domain using elliptic theta functions are presented. The temperature field is a solution of a nonlinear integral equation which is solved numerically by iteration. The resulting algorithm is very robust, stable and accurate with reliable convergence properties and avoids matrix inversions completely. The algorithm can deal with all sizes of volume heat sources without additional grid generation. Large and small size volume heat sources are treated simultaneously in the calculations that will be presented. Heat transfer coefficients are chosen representing radiative and convective boundary conditions. An extension of the solution algorithm to composed multilayer systems of arbitrary geometry is outlined.</description><subject>Algorithms</subject><subject>Boundary conditions</subject><subject>Conducting materials</subject><subject>Green's function methods</subject><subject>Green's functions</subject><subject>Heat transfer</subject><subject>Integral equations</subject><subject>Mathematical analysis</subject><subject>Mathematical models</subject><subject>Mesh generation</subject><subject>Multi-chip-modules (MCMs)</subject><subject>Nonhomogeneous media</subject><subject>Nonlinear equations</subject><subject>nonlinear heat conduction with Green's function method</subject><subject>Nonlinearity</subject><subject>radiative and convective boundary conditions</subject><subject>Representations</subject><subject>Robustness</subject><subject>Studies</subject><subject>Temperature dependence</subject><subject>Temperature distribution</subject><subject>thermal transient modeling</subject><issn>1521-3331</issn><issn>1557-9972</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><recordid>eNp9kU1LAzEQhhdRsFZ_gHgJHvS0NV-bTY6l-AUFPdSjhGw6qynbpCa7SP-9qRUED55mGJ4Z5n3fojgneEIIVjeL2fR5MaEY84nkjEhxUIxIVdWlUjU93PWUlIwxclycpLTCmHDJ1ah4XUTjkwPfox7WG4imHyKg1kG3TOjT9e_oDXwed8gH3zkPJqImDH5p4hbZ4Jeud8En5DyCDmwfg3cWpW3K59JpcdSaLsHZTx0XL3e3i9lDOX-6f5xN56VlVdWXLWe0VULY_FPujAQpFZOmagSuWV1LZg23S0sEtI1oBeW8yUopbWTVCibZuLje393E8DFA6vXaJQtdZzyEIWmpBKlZFp3Jq39JKsnOmSqDl3_AVRiizyq0FAorxQnNENlDNoaUIrR6E906O6MJ1rtc9HcuepeL3ueSdy72Ow4AfnmOqcCSfQETlon_</recordid><startdate>20050301</startdate><enddate>20050301</enddate><creator>Gerstenmaier, Y.C.</creator><creator>Wachutka, G.K.M.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20050301</creationdate><title>Transient temperature fields with general nonlinear boundary conditions in electronic systems</title><author>Gerstenmaier, Y.C. ; Wachutka, G.K.M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c355t-f432f966c48432fa8e88938a5b60737783ca4cdc16efb6f6244b00422b85f6383</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Algorithms</topic><topic>Boundary conditions</topic><topic>Conducting materials</topic><topic>Green's function methods</topic><topic>Green's functions</topic><topic>Heat transfer</topic><topic>Integral equations</topic><topic>Mathematical analysis</topic><topic>Mathematical models</topic><topic>Mesh generation</topic><topic>Multi-chip-modules (MCMs)</topic><topic>Nonhomogeneous media</topic><topic>Nonlinear equations</topic><topic>nonlinear heat conduction with Green's function method</topic><topic>Nonlinearity</topic><topic>radiative and convective boundary conditions</topic><topic>Representations</topic><topic>Robustness</topic><topic>Studies</topic><topic>Temperature dependence</topic><topic>Temperature distribution</topic><topic>thermal transient modeling</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Gerstenmaier, Y.C.</creatorcontrib><creatorcontrib>Wachutka, G.K.M.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on components and packaging technologies</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Gerstenmaier, Y.C.</au><au>Wachutka, G.K.M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Transient temperature fields with general nonlinear boundary conditions in electronic systems</atitle><jtitle>IEEE transactions on components and packaging technologies</jtitle><stitle>TCAPT</stitle><date>2005-03-01</date><risdate>2005</risdate><volume>28</volume><issue>1</issue><spage>23</spage><epage>33</epage><pages>23-33</pages><issn>1521-3331</issn><eissn>1557-9972</eissn><coden>ITCPFB</coden><abstract>Green's function representations of the solution of the heat conduction equation for general boundary conditions are generalized for the nonlinear, i.e., temperature dependent case. Temperature dependent heat transfer coefficients lead to additional terms in the Green's function representation of the temperature field. For a rectangular structure with averaged homogeneous material parameters several types of Green's functions can be chosen especially simple, because of the new representation with the possibility of differing types of boundary conditions for the temperature field and the Green's function. Exact finite closed form expressions for three-dimensional-Green's functions in the time domain using elliptic theta functions are presented. The temperature field is a solution of a nonlinear integral equation which is solved numerically by iteration. The resulting algorithm is very robust, stable and accurate with reliable convergence properties and avoids matrix inversions completely. The algorithm can deal with all sizes of volume heat sources without additional grid generation. Large and small size volume heat sources are treated simultaneously in the calculations that will be presented. Heat transfer coefficients are chosen representing radiative and convective boundary conditions. An extension of the solution algorithm to composed multilayer systems of arbitrary geometry is outlined.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TCAPT.2004.843186</doi><tpages>11</tpages></addata></record> |
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subjects | Algorithms Boundary conditions Conducting materials Green's function methods Green's functions Heat transfer Integral equations Mathematical analysis Mathematical models Mesh generation Multi-chip-modules (MCMs) Nonhomogeneous media Nonlinear equations nonlinear heat conduction with Green's function method Nonlinearity radiative and convective boundary conditions Representations Robustness Studies Temperature dependence Temperature distribution thermal transient modeling |
title | Transient temperature fields with general nonlinear boundary conditions in electronic systems |
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