Packaging Effect on MEMS Pressure Sensor Performance

• Published in: IEEE transactions on components and packaging technologies 2007-06, Vol.30 (2), p.285-293
• Main Authors: Krondorfer, R.H., Kim, Y.K.
• Format: Article
• Language: English
• Subjects: Conducting materials; Finite element method (FEM); Mathematical analysis; Mathematical models; micro-electro-mechanical system (MEMS) package; Microelectromechanical systems; Micromechanical devices; Molding compounds; Packaging; packaging stress; plastic packaging; Pressure measurement; Pressure sensors; Sensor phenomena and characterization; Sensor systems; Sensors; Stress; Stresses; Temperature sensors; viscoelasticity; Voltage; Voltage measurement
• ISSN: 1521-3331; 1557-9972
• DOI: 10.1109/TCAPT.2007.898360

In this study, the effect of epoxy based molding compound packaging on a micro-electro-mechanical system (MEMS) pressure sensor performance is investigated. A series of experiments were conducted to characterize the MEMS sensor over temperature and pressure changes by measuring output voltage signals. The sensor was modeled by a finite element method to investigate the stress developments. The molding compound was assumed as elastic and viscoelastic material to examine the material modeling effect on the calculation results. The model was verified by comparing the calculated results with experimental data. It was found that the stress induced by the molding compound had significant influence on the sensor performance, and the accuracy of the calculations was highly dependent on the modeling of the molding compound. Based on the results, the mechanism of the stress development and its effect on the sensor signal were discussed