Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied experimentally as well as with finite-element (FE) simulations. The reliability tests were composed of the thermal shock test, the local thermal cycling test (resistors embedded...

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Bibliographic Details
Published in:IEEE transactions on components and packaging technologies 2009-06, Vol.32 (2), p.302-308
Main Authors: Jue Li, Karppinen, J., Laurila, T., Kivilahti, J.K.
Format: Article
Language:English
Subjects:
Computer simulation
Cycles
Electric shock
Electronics packaging
Environmentally friendly manufacturing techniques
Finite element method
Finite element methods
Finite-element method (FEM
Interconnections
Iron
Lead
lead free
Life testing
Mathematical analysis
Mathematical models
Metallurgy
power cycling test
reliability
Sequential analysis
solder joint
Solders
Studies
Thermal cycling tests
Thermal resistance
thermal shock test
Transient analysis
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Summary:Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied experimentally as well as with finite-element (FE) simulations. The reliability tests were composed of the thermal shock test, the local thermal cycling test (resistors embedded in the board around the package), and the power cycling test (heat generation in the die). A 3-D board-level finite-element analysis (FEA) with local models was carried out to estimate the reliability of the solder interconnections under various test conditions. Due to the transient nature of the local thermal cycling test and the power cycling test, a sequential thermal-structural coupling analysis was employed to simulate the transient temperature distribution as well as the mechanical responses. Darveaux's approach was used to predict the life time of the solder interconnections. Furthermore, the numerical results validated by the experimental results indicated that the diagonal solder interconnections beneath the die edge were the most critical ones of all the tests studied here. It has been found that the fatigue life in the power cycling test was much longer than that in the other two tests. Detailed discussions about the failure mechanism of solder interconnections as well as the microstructural observations of the primary cracks are reported in this paper.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2009.2012518