Return-Path Extraction Technique for SSO Analysis of Low-Cost Wire-Bonding BGA Packages

A return-path decomposition method that eliminates artificial return-path discontinuities is presented. The methodology is applied to over 2 Gb/s simultaneous switching output analysis of a low-cost wire-bonding-type ball grid array package with a 32-bit double-data rate interface. The analysis is b...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-04, Vol.2 (4), p.677-686
Main Authors: Oikawa, R., Gope, D., Jandhyala, V.
Format: Article
Language:English
Subjects:
Analytical models
Applied sciences
Circuit properties
Couplings
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronic circuits
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Impedance
Integrated circuit modeling
Integrated circuits
Integrated circuits by function (including memories and processors)
Miscellaneous
Power supplies
Return path
Scattering parameters
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
simultaneous switching noise
simultaneous switching output
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Summary:A return-path decomposition method that eliminates artificial return-path discontinuities is presented. The methodology is applied to over 2 Gb/s simultaneous switching output analysis of a low-cost wire-bonding-type ball grid array package with a 32-bit double-data rate interface. The analysis is based on true transistor-level signal-power simulation and a large-scale, full-wave full 3-D boundary element method field solver package model. The simulation results suggest that in a weak return-path system, such as a wire-bonding-type package, the I/O performance is mainly dominated by the signal channel design rather than the power supply design in over 2-Gb/s region. The power supply acts as a secondary signal return path rather than as a noise source. The power supply design should be more focused on the main driver/predriver power supply noise interference in those systems.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2012.2187015