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Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications

A new technology, which combines diffusion bonding with rolling, was used to manufacture Cu/Mo70-Cu/Cu (CPC) composites for electronic packaging applications. Three samples with different thickness ratios were manufactured. CPC composites with low coefficient of thermal expansion (8.5×10 -6 K -1 ),...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2014-01, Vol.4 (1), p.4-7
Main Authors: Wang, Xiaoying, Wang, Dezhi, Yang, Yihang, Liang, Dandan, Dong, Xiaojia
Format: Article
Language:English
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Summary:A new technology, which combines diffusion bonding with rolling, was used to manufacture Cu/Mo70-Cu/Cu (CPC) composites for electronic packaging applications. Three samples with different thickness ratios were manufactured. CPC composites with low coefficient of thermal expansion (8.5×10 -6 K -1 ), high thermal conductivity (278 W/(m·K)), low density (9.2 g/cm 3 ), and particularly high bond strength (265 MPa) were manufactured. The bond mechanism of CPC composites is a combination of the metallic bond, direct Cu-Cu bonding and surface rupture mechanism. Compared with the traditional processes, CPC composites manufactured by this method have such advantages as high bond strength, controllable thickness ratio, and miniaturization.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2013.2280922