Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications

A new technology, which combines diffusion bonding with rolling, was used to manufacture Cu/Mo70-Cu/Cu (CPC) composites for electronic packaging applications. Three samples with different thickness ratios were manufactured. CPC composites with low coefficient of thermal expansion (8.5×10 -6 K -1 ),...

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Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2014-01, Vol.4 (1), p.4-7
Main Authors: Wang, Xiaoying, Wang, Dezhi, Yang, Yihang, Liang, Dandan, Dong, Xiaojia
Format: Article
Language:English
Subjects:
Bonding
Bonding strength
Cu/Mo70-Cu/Cu (CPC)
Diffusion bonding
Electronic packaging thermal management
Electronics packaging
Materials
Metals
rolling
Surface treatment
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cited_by cdi_FETCH-LOGICAL-c295t-58429f144a46ceed211262cd28e5b2262e00a096ce1740a77d8f9e828a6ede263
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creator Wang, Xiaoying
Wang, Dezhi
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description A new technology, which combines diffusion bonding with rolling, was used to manufacture Cu/Mo70-Cu/Cu (CPC) composites for electronic packaging applications. Three samples with different thickness ratios were manufactured. CPC composites with low coefficient of thermal expansion (8.5×10 -6 K -1 ), high thermal conductivity (278 W/(m·K)), low density (9.2 g/cm 3 ), and particularly high bond strength (265 MPa) were manufactured. The bond mechanism of CPC composites is a combination of the metallic bond, direct Cu-Cu bonding and surface rupture mechanism. Compared with the traditional processes, CPC composites manufactured by this method have such advantages as high bond strength, controllable thickness ratio, and miniaturization.
doi_str_mv 10.1109/TCPMT.2013.2280922
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source IEEE Electronic Library (IEL) Journals
subjects Bonding
Bonding strength
Cu/Mo70-Cu/Cu (CPC)
Diffusion bonding
Electronic packaging thermal management
Electronics packaging
Materials
Metals
rolling
Surface treatment
title Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications
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