Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling

Microfluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si microcooler with multiple drainage microtrenches (MDMTs) has been developed for microelectronic thermal management. Integrated with MDMT in hybrid microcooler, the negative...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-01, Vol.7 (1), p.50-57
Main Authors: Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee, Daniel
Format: Article
Language:English
Subjects:
Adaptation models
Cooling
Drainage microtrench
Heat pumps
Heat transfer
Heating
high heat flux cooling
Inlet flow
microchannel flow
Microchannels
microjet impingement
Si microcooler
Silicon
Temperature distribution
Thermal management
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Microfluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si microcooler with multiple drainage microtrenches (MDMTs) has been developed for microelectronic thermal management. Integrated with MDMT in hybrid microcooler, the negative cross-flow effect between nearby nozzles is eliminated, and thus fully developed jet impingement can be enabled for each nozzle. An inlet/outlet flow arrangement layer has been introduced to achieve uniform pressure distribution. The effects of three types of arrangement structures on the hydraulic and thermal performance of microcooler have been analyzed and compared. Two different thermal/fluid simulation models have been constructed for microcooler design. The test vehicle with the new nozzle/trench layer is fabricated using double-side deep reactive-ion etching process. Assembly of the stacked microcooler and Si thermal test chip is finished through two-steps optimized thermal compression bonding process. With 0.05-W pumping power for the microcooler, the heat dissipation of 260 W/cm 2 has been demonstrated, and the chip temperature can be maintained under 51 °C. Excellent agreement has been obtained between experimental and simulation results. With the MDMT, enhanced-microjet array impinging has been achieved, and uniform chip temperature distribution is obtained.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2016.2627040