Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package

The mechanical/optical configuration of moiré interferometry for real-time observation of thermal deformations is advanced to quantify the thermomechanical behavior of fan-out wafer level packages (FO-WLPs). Two most notable advancements are on the: 1) mechanical front: conduction-based thermal cha...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2018-05, Vol.8 (5), p.764-772
Main Authors: Wu, Bulong, Han, Bongtae
Format: Article
Language:English
Subjects:
Configurations
Deformation analysis
Fan-out wafer level packaging
Field of view
Interferometry
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Microscopy
moiré interferometry
Optical interferometry
Real time
real-time observation
Real-time systems
Reliability analysis
reworkable underfill
Strain
Temperature control
Temperature measurement
Thermal conductivity
Thermomechanical properties
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Summary:The mechanical/optical configuration of moiré interferometry for real-time observation of thermal deformations is advanced to quantify the thermomechanical behavior of fan-out wafer level packages (FO-WLPs). Two most notable advancements are on the: 1) mechanical front: conduction-based thermal chamber for a wide range of ramp rates with accurate temperature control, and 2) optical front: microscope objectives to observe a microscopic field of view. The advancements enable the method to document the global and local behavior of an FO-WLP while it is subjected to a controlled thermal excursion. After describing the details of two advancements, a procedure of actual testing is presented. The advanced configuration is implemented to analyze an FO-WLP in a package-on-package with and without a reworkable underfill. The results obtained from the global and local analyses are presented, and reliability implications are discussed.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2018.2805873