3-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads

Harnessing phase change materials (PCMs) for thermal management of power electronic devices shows potential to improve their reliability while decreasing the size, weight, power, and cost (SWaP-C) of the system due to the PCM's high latent heat during solid-to-liquid transition. However, despit...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2024, p.1-1
Main Authors: Randriambololona, Andoniaina M., Manepalli, Vivek, McAfee, Rachel C., Ojha, Bidisha, Miraftab-Salo, Rahi, Guye, Kidus, Lee, Hyoungsoon, Graham, Samuel, Agonafer, Damena
Format: Article
Language:English
Subjects:
Conductivity
Copper
Heating systems
Metals
Phase change materials
Thermal conductivity
thermal energy storage
Thermal loading
transient thermal management
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Summary:Harnessing phase change materials (PCMs) for thermal management of power electronic devices shows potential to improve their reliability while decreasing the size, weight, power, and cost (SWaP-C) of the system due to the PCM's high latent heat during solid-to-liquid transition. However, despite its high latent heat of fusion, PCMs are limited by their low thermal conductivity and a narrow operational temperature range near their melting point. We here numerically investigate the thermal buffering capability of three distinct compositions of a novel three-component composite PCM consisting of organic microencapsulated paraffin and metallic Fields metal with similar melting temperatures and copper cylindrical micropillars. These composites are evaluated under different single pulse width heating and cooling conditions and are benchmarked against a pure copper block. Results indicate that the composites generally surpass pure copper in minimizing peak device junction temperatures when the PCM undergoes phase change under single pulse loading, with the best performing composite consistently achieving a lower junction temperature than the copper block. The best performing composite can achieve up to 44% reduction in junction temperature swing compared to the copper reference when under a pulse train loading. These findings highlight the potential of the 3-component composite system as an effective thermal buffer for electronics subjected to transient heat loads.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2024.3376234