Self Repair in Circuits-Automating Open Fault Repair in Integrated Circuits Using Field-Induced Aggregation of Carbon Nanotubes

This paper presents studies on the use of carbon nanotubes dispersed in an insulating fluid to serve as an automaton for healing open-circuit interconnect faults in integrated circuits. The physics behind the repair mechanism is the electric-field-induced diffusion limited aggregation. On the occurr...

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Bibliographic Details
Published in:IEEE transactions on electron devices 2012-06, Vol.59 (6), p.1773-1779
Main Author: Sambandan, S.
Format: Article
Language:English
Subjects:
Applied sciences
Automation
Bridge circuits
Bridges
carbon nanotubes (CNTs)
Circuit faults
Cross-disciplinary physics: materials science
rheology
Current density
Design. Technologies. Operation analysis. Testing
Dispersion
Electrodes
Electronics
Exact sciences and technology
integrated circuit
Integrated circuits
Maintenance engineering
Materials science
Nanoscale materials and structures: fabrication and characterization
Nanotubes
Physics
reliability
repair
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:This paper presents studies on the use of carbon nanotubes dispersed in an insulating fluid to serve as an automaton for healing open-circuit interconnect faults in integrated circuits. The physics behind the repair mechanism is the electric-field-induced diffusion limited aggregation. On the occurrence of an open fault, the repair is automatically triggered due to the presence of an electric field across the gap. We perform studies on the repair time as a function of the electric field and dispersion concentrations with the above application in mind.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2012.2191557