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Self Repair in Circuits-Automating Open Fault Repair in Integrated Circuits Using Field-Induced Aggregation of Carbon Nanotubes

This paper presents studies on the use of carbon nanotubes dispersed in an insulating fluid to serve as an automaton for healing open-circuit interconnect faults in integrated circuits. The physics behind the repair mechanism is the electric-field-induced diffusion limited aggregation. On the occurr...

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Published in:	IEEE transactions on electron devices 2012-06, Vol.59 (6), p.1773-1779
Main Author:	Sambandan, S.
Format:	Article
Language:	English
Subjects:	Applied sciences Automation Bridge circuits Bridges carbon nanotubes (CNTs) Circuit faults Cross-disciplinary physics: materials science rheology Current density Design. Technologies. Operation analysis. Testing Dispersion Electrodes Electronics Exact sciences and technology integrated circuit Integrated circuits Maintenance engineering Materials science Nanoscale materials and structures: fabrication and characterization Nanotubes Physics reliability repair Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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container_title	IEEE transactions on electron devices
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description	This paper presents studies on the use of carbon nanotubes dispersed in an insulating fluid to serve as an automaton for healing open-circuit interconnect faults in integrated circuits. The physics behind the repair mechanism is the electric-field-induced diffusion limited aggregation. On the occurrence of an open fault, the repair is automatically triggered due to the presence of an electric field across the gap. We perform studies on the repair time as a function of the electric field and dispersion concentrations with the above application in mind.
doi_str_mv	10.1109/TED.2012.2191557
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Technologies. Operation analysis. Testing</topic><topic>Dispersion</topic><topic>Electrodes</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>integrated circuit</topic><topic>Integrated circuits</topic><topic>Maintenance engineering</topic><topic>Materials science</topic><topic>Nanoscale materials and structures: fabrication and characterization</topic><topic>Nanotubes</topic><topic>Physics</topic><topic>reliability</topic><topic>repair</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. 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subjects	Applied sciences Automation Bridge circuits Bridges carbon nanotubes (CNTs) Circuit faults Cross-disciplinary physics: materials science rheology Current density Design. Technologies. Operation analysis. Testing Dispersion Electrodes Electronics Exact sciences and technology integrated circuit Integrated circuits Maintenance engineering Materials science Nanoscale materials and structures: fabrication and characterization Nanotubes Physics reliability repair Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title	Self Repair in Circuits-Automating Open Fault Repair in Integrated Circuits Using Field-Induced Aggregation of Carbon Nanotubes
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