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Channel Hot Carrier Degradation Mechanism in Long/Short Channel n-FinFETs
The channel hot carrier degradation mechanisms in n-FinFET devices are studied. In long channel devices, interface degradation by hot carriers mainly degrades the device at the maximum impact ionization condition (V G ~ V D /2). At higher V G closer to V D , cold and hot carrier injection to the oxi...
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Published in: | IEEE transactions on electron devices 2013-12, Vol.60 (12), p.4002-4007 |
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container_issue | 12 |
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container_title | IEEE transactions on electron devices |
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creator | Moonju Cho Roussel, Philippe Kaczer, Ben Degraeve, Robin Franco, Jacopo Aoulaiche, Marc Chiarella, Thomas Kauerauf, Thomas Horiguchi, Naoto Groeseneken, Guido |
description | The channel hot carrier degradation mechanisms in n-FinFET devices are studied. In long channel devices, interface degradation by hot carriers mainly degrades the device at the maximum impact ionization condition (V G ~ V D /2). At higher V G closer to V D , cold and hot carrier injection to the oxide bulk defect increases and dominates at the V G =V D stress condition. On the other hand, in short channel devices, hot carriers are generated continuously with respect to V G and highly at V G =V D , and this hot carrier injection into the oxide bulk defect is the main degradation mechanism. |
doi_str_mv | 10.1109/TED.2013.2285245 |
format | article |
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In long channel devices, interface degradation by hot carriers mainly degrades the device at the maximum impact ionization condition (V G ~ V D /2). At higher V G closer to V D , cold and hot carrier injection to the oxide bulk defect increases and dominates at the V G =V D stress condition. On the other hand, in short channel devices, hot carriers are generated continuously with respect to V G and highly at V G =V D , and this hot carrier injection into the oxide bulk defect is the main degradation mechanism.</description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2013.2285245</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Charge trapping ; Degradation ; Electronics ; Exact sciences and technology ; FinFET ; hot carrier ; Hot carrier injection ; Impact ionization ; logic device ; Logic gates ; multigate FET ; Semiconductor electronics. Microelectronics. Optoelectronics. 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In long channel devices, interface degradation by hot carriers mainly degrades the device at the maximum impact ionization condition (V G ~ V D /2). At higher V G closer to V D , cold and hot carrier injection to the oxide bulk defect increases and dominates at the V G =V D stress condition. On the other hand, in short channel devices, hot carriers are generated continuously with respect to V G and highly at V G =V D , and this hot carrier injection into the oxide bulk defect is the main degradation mechanism.</description><subject>Applied sciences</subject><subject>Charge trapping</subject><subject>Degradation</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>FinFET</subject><subject>hot carrier</subject><subject>Hot carrier injection</subject><subject>Impact ionization</subject><subject>logic device</subject><subject>Logic gates</subject><subject>multigate FET</subject><subject>Semiconductor electronics. Microelectronics. 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Microelectronics. Optoelectronics. Solid state devices</topic><topic>Stress</topic><topic>Temperature measurement</topic><topic>Transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Moonju Cho</creatorcontrib><creatorcontrib>Roussel, Philippe</creatorcontrib><creatorcontrib>Kaczer, Ben</creatorcontrib><creatorcontrib>Degraeve, Robin</creatorcontrib><creatorcontrib>Franco, Jacopo</creatorcontrib><creatorcontrib>Aoulaiche, Marc</creatorcontrib><creatorcontrib>Chiarella, Thomas</creatorcontrib><creatorcontrib>Kauerauf, Thomas</creatorcontrib><creatorcontrib>Horiguchi, Naoto</creatorcontrib><creatorcontrib>Groeseneken, Guido</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE/IET Electronic Library</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Moonju Cho</au><au>Roussel, Philippe</au><au>Kaczer, Ben</au><au>Degraeve, Robin</au><au>Franco, Jacopo</au><au>Aoulaiche, Marc</au><au>Chiarella, Thomas</au><au>Kauerauf, Thomas</au><au>Horiguchi, Naoto</au><au>Groeseneken, Guido</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Channel Hot Carrier Degradation Mechanism in Long/Short Channel n-FinFETs</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>2013-12-01</date><risdate>2013</risdate><volume>60</volume><issue>12</issue><spage>4002</spage><epage>4007</epage><pages>4002-4007</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract>The channel hot carrier degradation mechanisms in n-FinFET devices are studied. In long channel devices, interface degradation by hot carriers mainly degrades the device at the maximum impact ionization condition (V G ~ V D /2). At higher V G closer to V D , cold and hot carrier injection to the oxide bulk defect increases and dominates at the V G =V D stress condition. On the other hand, in short channel devices, hot carriers are generated continuously with respect to V G and highly at V G =V D , and this hot carrier injection into the oxide bulk defect is the main degradation mechanism.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TED.2013.2285245</doi><tpages>6</tpages></addata></record> |
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subjects | Applied sciences Charge trapping Degradation Electronics Exact sciences and technology FinFET hot carrier Hot carrier injection Impact ionization logic device Logic gates multigate FET Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Stress Temperature measurement Transistors |
title | Channel Hot Carrier Degradation Mechanism in Long/Short Channel n-FinFETs |
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