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A Novel Vertical Field Plate Lateral Device With Ultralow Specific On-Resistance

A novel vertical field plate (VFP) lateral device with ultralow specific on-resistance (RON,sp) is proposed in this paper. The VFP surrounded by oxide is inserted in the bulk of the drift region. Compared to the surface local depletion of the conventional lateral field plate (LFP), the depletion lay...

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Published in:IEEE transactions on electron devices 2014-02, Vol.61 (2), p.518-524
Main Authors: Zhang, Wentong, Zhang, Bo, Qiao, Ming, Wu, Lijuan, Mao, Kun, Li, Zhaoji
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Language:English
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cited_by cdi_FETCH-LOGICAL-c324t-861202828d57bea93306aee34a2a91fe6718b18bfe2cca3025ff7a17ed3178dd3
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container_title IEEE transactions on electron devices
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creator Zhang, Wentong
Zhang, Bo
Qiao, Ming
Wu, Lijuan
Mao, Kun
Li, Zhaoji
description A novel vertical field plate (VFP) lateral device with ultralow specific on-resistance (RON,sp) is proposed in this paper. The VFP surrounded by oxide is inserted in the bulk of the drift region. Compared to the surface local depletion of the conventional lateral field plate (LFP), the depletion layer of the VFP expands to the bulk of the drift region, which enhances the bulk electric field. Therefore, ultralow RON,sp is realized in the VFP device due to high drift-region doping (Nd) and short cell pitch. An analytical FP model is developed to describe the behavior of the VFP, in which the breakdown voltage (BV) and Nd are found to be proportional to the FP factor k. Then the uniform-doped VFP laterally diffused MOSs and the step-doped VFP laterally diffused MOS are proposed. The optimized device exhibits a BV of 945 V and a RON,sp of 34 mΩ·cm 2 which are superior to those of similar devices and the silicon limit.
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The VFP surrounded by oxide is inserted in the bulk of the drift region. Compared to the surface local depletion of the conventional lateral field plate (LFP), the depletion layer of the VFP expands to the bulk of the drift region, which enhances the bulk electric field. Therefore, ultralow RON,sp is realized in the VFP device due to high drift-region doping (Nd) and short cell pitch. An analytical FP model is developed to describe the behavior of the VFP, in which the breakdown voltage (BV) and Nd are found to be proportional to the FP factor k. Then the uniform-doped VFP laterally diffused MOSs and the step-doped VFP laterally diffused MOS are proposed. The optimized device exhibits a BV of 945 V and a RON,sp of 34 mΩ·cm 2 which are superior to those of similar devices and the silicon limit.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TED.2013.2294643</doi><tpages>7</tpages></addata></record>
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subjects Breakdown voltage
Depletion
Devices
Dielectrics
Diffusion
Doping
Drift
Educational institutions
Electric potential
enhanced bulk depletion
Equations
Etching
Filled plastics
laterally diffused MOS
Mathematical models
Moss
R_{{\rm ON}
rm sp
Silicon
silicon limit
surface local depletion
vertical field plate (VFP)
Voltage
title A Novel Vertical Field Plate Lateral Device With Ultralow Specific On-Resistance
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