Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain

This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one...

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Bibliographic Details
Published in:IEEE transactions on electron devices 2014-07, Vol.61 (7), p.2584-2587
Main Authors: Sanming Hu, Cheng Jin, Hongyu Li, Rui Li, Ser Choong Chong, Ming Chinq Jong, Wai, Eva Leong Ching, Keng Hwa Teo, Minkyu Je, Lo, Patrick Guo Qiang
Format: Article
Language:English
Subjects:
3-D integrated circuit (3-D IC)
Boards
Chains
Chips
CMOS
Current measurement
Educational institutions
Electrical resistance measurement
Integrated circuits
location
open
parallel resistor chain
Printed circuits
Resistance
Resistors
Three dimensional
through silicon via (TSV)
Through-silicon vias
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Description
Summary:This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2014.2321453