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Dual Ferroelectric Stack of HfZrO₂/Al:HfO₂ With Tunable Coercive Voltage for High-Density Memory Applications
To achieve a multilevel threshold voltage in the configuration of a ferroelectric field-effect transistor for high-density memories, it is crucial to achieve a finely tunable coercive voltage ( {V}_{\text {C}}{)} of the ferroelectric layer (FL). In this study, we demonstrate that the use of dual fe...
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Published in: | IEEE transactions on electron devices 2024-06, Vol.71 (6), p.3981-3984 |
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description | To achieve a multilevel threshold voltage in the configuration of a ferroelectric field-effect transistor for high-density memories, it is crucial to achieve a finely tunable coercive voltage ( {V}_{\text {C}}{)} of the ferroelectric layer (FL). In this study, we demonstrate that the use of dual ferroelectric stacks with Zr-doped HfO2 (HZO) and Al-doped HfO2 (HAO) allows the adjustment of {V}_{\text {C}} and remnant polarization ( {P}_{r}{)} over a broad range relative to the ramping voltage. When a single HZO FL is used, a rapid increase in {P}_{r} is observed, reaching approximately 30~\mu \text{C} /cm2 at a specific {V}_{\text {C}} value. In contrast, the HAO FL progresses at a slower rate, achieving a smaller {P}_{r} value approximately equal to 7~\mu \text{C} /cm2 with increasing voltage. In the dual-stack configuration, polarization occurs sequentially through each FL, enabling the incremental adjustment of {V}_{\text {C}} . The stress primarily arises after the deposition of the top electrode during annealing, thus emphasizing the crucial role of the upper FL in the ferroelectric properties of the dual stack. Furthermore, our findings reveal that substituting a dielectric layer (DL)for the HAO FL, rather than the HZO FL, exacerbates polarization, revealing that the synergistic effect originates from two different FLs. |
doi_str_mv | 10.1109/TED.2024.3387884 |
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In this study, we demonstrate that the use of dual ferroelectric stacks with Zr-doped HfO2 (HZO) and Al-doped HfO2 (HAO) allows the adjustment of <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula> and remnant polarization (<inline-formula> <tex-math notation="LaTeX">{P}_{r}{)} </tex-math></inline-formula> over a broad range relative to the ramping voltage. When a single HZO FL is used, a rapid increase in <inline-formula> <tex-math notation="LaTeX">{P}_{r} </tex-math></inline-formula> is observed, reaching approximately <inline-formula> <tex-math notation="LaTeX">30~\mu \text{C} </tex-math></inline-formula>/cm2 at a specific <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula> value. In contrast, the HAO FL progresses at a slower rate, achieving a smaller <inline-formula> <tex-math notation="LaTeX">{P}_{r} </tex-math></inline-formula> value approximately equal to <inline-formula> <tex-math notation="LaTeX">7~\mu \text{C} </tex-math></inline-formula>/cm2 with increasing voltage. In the dual-stack configuration, polarization occurs sequentially through each FL, enabling the incremental adjustment of <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula>. The stress primarily arises after the deposition of the top electrode during annealing, thus emphasizing the crucial role of the upper FL in the ferroelectric properties of the dual stack. Furthermore, our findings reveal that substituting a dielectric layer (DL)for the HAO FL, rather than the HZO FL, exacerbates polarization, revealing that the synergistic effect originates from two different FLs.]]></description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2024.3387884</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Al:HFO ; Annealing ; Coercivity ; Configurations ; Dielectrics ; dual ferroelectric stack ; Electrodes ; FeFETs ; Ferroelectric materials ; ferroelectric memory ; Ferroelectricity ; Field effect transistors ; Hafnium oxide ; HfZrO ; High density ; Polarization ; Semiconductor devices ; Stress ; Synergistic effect ; Temperature measurement ; Threshold voltage ; Zirconium</subject><ispartof>IEEE transactions on electron devices, 2024-06, Vol.71 (6), p.3981-3984</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c175t-febcb732c2b1661e7ba06ad5ab1471fe8ea06adcf28c8f70d14a290b4f64ec593</cites><orcidid>0000-0002-4968-6985 ; 0000-0001-9101-1028 ; 0000-0001-6012-3502 ; 0000-0003-4129-4853 ; 0009-0004-9676-9355 ; 0000-0003-3194-9481</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/10502354$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,54796</link.rule.ids></links><search><creatorcontrib>Jeong, Jiae</creatorcontrib><creatorcontrib>Park, Hyoungjin</creatorcontrib><creatorcontrib>Kim, Nayeon</creatorcontrib><creatorcontrib>Kim, Hyun Wook</creatorcontrib><creatorcontrib>Hong, Eunryeong</creatorcontrib><creatorcontrib>Choi, Hyeonsik</creatorcontrib><creatorcontrib>Jeon, Seonuk</creatorcontrib><creatorcontrib>Kim, Yunsur</creatorcontrib><creatorcontrib>Woo, Jiyong</creatorcontrib><title>Dual Ferroelectric Stack of HfZrO₂/Al:HfO₂ With Tunable Coercive Voltage for High-Density Memory Applications</title><title>IEEE transactions on electron devices</title><addtitle>TED</addtitle><description><![CDATA[To achieve a multilevel threshold voltage in the configuration of a ferroelectric field-effect transistor for high-density memories, it is crucial to achieve a finely tunable coercive voltage (<inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}}{)} </tex-math></inline-formula> of the ferroelectric layer (FL). In this study, we demonstrate that the use of dual ferroelectric stacks with Zr-doped HfO2 (HZO) and Al-doped HfO2 (HAO) allows the adjustment of <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula> and remnant polarization (<inline-formula> <tex-math notation="LaTeX">{P}_{r}{)} </tex-math></inline-formula> over a broad range relative to the ramping voltage. When a single HZO FL is used, a rapid increase in <inline-formula> <tex-math notation="LaTeX">{P}_{r} </tex-math></inline-formula> is observed, reaching approximately <inline-formula> <tex-math notation="LaTeX">30~\mu \text{C} </tex-math></inline-formula>/cm2 at a specific <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula> value. In contrast, the HAO FL progresses at a slower rate, achieving a smaller <inline-formula> <tex-math notation="LaTeX">{P}_{r} </tex-math></inline-formula> value approximately equal to <inline-formula> <tex-math notation="LaTeX">7~\mu \text{C} </tex-math></inline-formula>/cm2 with increasing voltage. In the dual-stack configuration, polarization occurs sequentially through each FL, enabling the incremental adjustment of <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula>. The stress primarily arises after the deposition of the top electrode during annealing, thus emphasizing the crucial role of the upper FL in the ferroelectric properties of the dual stack. Furthermore, our findings reveal that substituting a dielectric layer (DL)for the HAO FL, rather than the HZO FL, exacerbates polarization, revealing that the synergistic effect originates from two different FLs.]]></description><subject>Al:HFO</subject><subject>Annealing</subject><subject>Coercivity</subject><subject>Configurations</subject><subject>Dielectrics</subject><subject>dual ferroelectric stack</subject><subject>Electrodes</subject><subject>FeFETs</subject><subject>Ferroelectric materials</subject><subject>ferroelectric memory</subject><subject>Ferroelectricity</subject><subject>Field effect transistors</subject><subject>Hafnium oxide</subject><subject>HfZrO</subject><subject>High density</subject><subject>Polarization</subject><subject>Semiconductor devices</subject><subject>Stress</subject><subject>Synergistic effect</subject><subject>Temperature measurement</subject><subject>Threshold voltage</subject><subject>Zirconium</subject><issn>0018-9383</issn><issn>1557-9646</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNpNkMtOwkAUhidGExHdu3AxievCXHtxR7hYEwwLURM3zXQ4A4OlA9PWhC2P6pNYxIWrc_7k-89JPoRuKelRSpL-fDzqMcJEj_M4imNxhjpUyihIQhGeow4hNA4SHvNLdFVV6zaGQrAO2o0aVeAJeO-gAF17q_FLrfQndgan5sPPvg-H_qB4SM1xw--2XuF5U6q8ADx04LX9AvzmilotARvncWqXq2AEZWXrPX6GjfN7PNhuC6tVbV1ZXaMLo4oKbv5mF71OxvNhGkxnj0_DwTTQNJJ1YCDXecSZZjkNQwpRrkioFlLlVETUQAy_WRsW69hEZEGFYgnJhQkFaJnwLro_3d16t2ugqrO1a3zZvsw4kYmkUUhIS5ETpb2rKg8m23q7UX6fUZIdxWat2OwoNvsT21buThULAP9wSRiXgv8AxU12sQ</recordid><startdate>20240601</startdate><enddate>20240601</enddate><creator>Jeong, Jiae</creator><creator>Park, Hyoungjin</creator><creator>Kim, Nayeon</creator><creator>Kim, Hyun Wook</creator><creator>Hong, Eunryeong</creator><creator>Choi, Hyeonsik</creator><creator>Jeon, Seonuk</creator><creator>Kim, Yunsur</creator><creator>Woo, Jiyong</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-4968-6985</orcidid><orcidid>https://orcid.org/0000-0001-9101-1028</orcidid><orcidid>https://orcid.org/0000-0001-6012-3502</orcidid><orcidid>https://orcid.org/0000-0003-4129-4853</orcidid><orcidid>https://orcid.org/0009-0004-9676-9355</orcidid><orcidid>https://orcid.org/0000-0003-3194-9481</orcidid></search><sort><creationdate>20240601</creationdate><title>Dual Ferroelectric Stack of HfZrO₂/Al:HfO₂ With Tunable Coercive Voltage for High-Density Memory Applications</title><author>Jeong, Jiae ; Park, Hyoungjin ; Kim, Nayeon ; Kim, Hyun Wook ; Hong, Eunryeong ; Choi, Hyeonsik ; Jeon, Seonuk ; Kim, Yunsur ; Woo, Jiyong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c175t-febcb732c2b1661e7ba06ad5ab1471fe8ea06adcf28c8f70d14a290b4f64ec593</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Al:HFO</topic><topic>Annealing</topic><topic>Coercivity</topic><topic>Configurations</topic><topic>Dielectrics</topic><topic>dual ferroelectric stack</topic><topic>Electrodes</topic><topic>FeFETs</topic><topic>Ferroelectric materials</topic><topic>ferroelectric memory</topic><topic>Ferroelectricity</topic><topic>Field effect transistors</topic><topic>Hafnium oxide</topic><topic>HfZrO</topic><topic>High density</topic><topic>Polarization</topic><topic>Semiconductor devices</topic><topic>Stress</topic><topic>Synergistic effect</topic><topic>Temperature measurement</topic><topic>Threshold voltage</topic><topic>Zirconium</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jeong, Jiae</creatorcontrib><creatorcontrib>Park, Hyoungjin</creatorcontrib><creatorcontrib>Kim, Nayeon</creatorcontrib><creatorcontrib>Kim, Hyun Wook</creatorcontrib><creatorcontrib>Hong, Eunryeong</creatorcontrib><creatorcontrib>Choi, Hyeonsik</creatorcontrib><creatorcontrib>Jeon, Seonuk</creatorcontrib><creatorcontrib>Kim, Yunsur</creatorcontrib><creatorcontrib>Woo, Jiyong</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) Online</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Jeong, Jiae</au><au>Park, Hyoungjin</au><au>Kim, Nayeon</au><au>Kim, Hyun Wook</au><au>Hong, Eunryeong</au><au>Choi, Hyeonsik</au><au>Jeon, Seonuk</au><au>Kim, Yunsur</au><au>Woo, Jiyong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Dual Ferroelectric Stack of HfZrO₂/Al:HfO₂ With Tunable Coercive Voltage for High-Density Memory Applications</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>2024-06-01</date><risdate>2024</risdate><volume>71</volume><issue>6</issue><spage>3981</spage><epage>3984</epage><pages>3981-3984</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract><![CDATA[To achieve a multilevel threshold voltage in the configuration of a ferroelectric field-effect transistor for high-density memories, it is crucial to achieve a finely tunable coercive voltage (<inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}}{)} </tex-math></inline-formula> of the ferroelectric layer (FL). In this study, we demonstrate that the use of dual ferroelectric stacks with Zr-doped HfO2 (HZO) and Al-doped HfO2 (HAO) allows the adjustment of <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula> and remnant polarization (<inline-formula> <tex-math notation="LaTeX">{P}_{r}{)} </tex-math></inline-formula> over a broad range relative to the ramping voltage. When a single HZO FL is used, a rapid increase in <inline-formula> <tex-math notation="LaTeX">{P}_{r} </tex-math></inline-formula> is observed, reaching approximately <inline-formula> <tex-math notation="LaTeX">30~\mu \text{C} </tex-math></inline-formula>/cm2 at a specific <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula> value. In contrast, the HAO FL progresses at a slower rate, achieving a smaller <inline-formula> <tex-math notation="LaTeX">{P}_{r} </tex-math></inline-formula> value approximately equal to <inline-formula> <tex-math notation="LaTeX">7~\mu \text{C} </tex-math></inline-formula>/cm2 with increasing voltage. In the dual-stack configuration, polarization occurs sequentially through each FL, enabling the incremental adjustment of <inline-formula> <tex-math notation="LaTeX">{V}_{\text {C}} </tex-math></inline-formula>. The stress primarily arises after the deposition of the top electrode during annealing, thus emphasizing the crucial role of the upper FL in the ferroelectric properties of the dual stack. Furthermore, our findings reveal that substituting a dielectric layer (DL)for the HAO FL, rather than the HZO FL, exacerbates polarization, revealing that the synergistic effect originates from two different FLs.]]></abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TED.2024.3387884</doi><tpages>4</tpages><orcidid>https://orcid.org/0000-0002-4968-6985</orcidid><orcidid>https://orcid.org/0000-0001-9101-1028</orcidid><orcidid>https://orcid.org/0000-0001-6012-3502</orcidid><orcidid>https://orcid.org/0000-0003-4129-4853</orcidid><orcidid>https://orcid.org/0009-0004-9676-9355</orcidid><orcidid>https://orcid.org/0000-0003-3194-9481</orcidid></addata></record> |
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subjects | Al:HFO Annealing Coercivity Configurations Dielectrics dual ferroelectric stack Electrodes FeFETs Ferroelectric materials ferroelectric memory Ferroelectricity Field effect transistors Hafnium oxide HfZrO High density Polarization Semiconductor devices Stress Synergistic effect Temperature measurement Threshold voltage Zirconium |
title | Dual Ferroelectric Stack of HfZrO₂/Al:HfO₂ With Tunable Coercive Voltage for High-Density Memory Applications |
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