Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling

In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated us...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2017-06, Vol.59 (3), p.940-951
Main Authors: Youngwoo Kim, Jonghyun Cho, Kim, Jonghoon J., Kyungjun Cho, Subin Kim, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao R., Joungho Kim
Format: Article
Language:English
Subjects:
Correlation analysis
Coupling
Couplings
Dispersion
Electric power distribution
Electromagnetic bandgap (EBG)
Glass
Glass substrates
High speed
interposer
Laminates
measurement
Metals
Metamaterials
Noise
Noise levels
Noise propagation
Photonic band gap
power/ground noise coupling
Propagation (polymerization)
Substrates
suppression
Test vehicles
Three dimensional analysis
through glass via (TGV)
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated using a thin-glass substrate, low-loss polymer layers, and periodic metal patches with through glass vias (TGVs) in glass interposer power distribution network. Using the dispersion characteristics, we thoroughly analyzed and derived f L and f U of the glass interposer EBG structure. We experimentally verified that the proposed glass interposer EBG structure achieved power/ground noise suppression (below -40 dB) between f L of 5.8 GHz and f U of 9.6 GHz. Derived f L and f U based on dispersion analysis, full three-dimensional electromagnetic (3-D-EM) simulation and measurement achieved good correlation. In the glass interposer EBG structure, tapered structure of the TGV and thickness of the low-loss polymer used for metal-layers lamination affected the noise suppression bandgap significantly. The effectiveness of the proposed glass interposer EBG structure on suppression of the power/ground noise propagation and coupling to high-speed TGV channel was verified with 3-D-EM simulation. As a result, the proposed glass interposer EBG structure successfully and efficiently suppressed the power/ground noise propagation and improved eye-diagram of the high-speed TGV channel.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2016.2632703