Electrical test strategies for a wafer-level packaging technology [Abstracts of Forthcoming Manuscripts]

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Bibliographic Details
Published in:IEEE transactions on electronics packaging manufacturing 2003-10, Vol.26 (4), p.264-264
Main Authors: Keezer, D.C., Patel, C.S., Bakir, M.S., Qing Zhou, Meindl, J.D.
Format: Article
Language:English
Online Access:Get full text
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ISSN:1521-334X
1558-0822
DOI:10.1109/TEPM.2003.823162