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Defects pattern recognition for flip-chip solder joint quality inspection with laser ultrasound and Interferometer

A defects pattern recognition system has been developed for the flip-chip solder joint quality inspection by using laser ultrasound and interferometric techniques. This system extracts error ratio and dominant frequency as features from ultrasound waveforms. It also performs a cluster analysis of th...

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Published in:	IEEE transactions on electronics packaging manufacturing 2004-01, Vol.27 (1), p.59-66
Main Authors:	Sheng Liu, Ume, I.C., Achari, A.
Format:	Article
Language:	English
Subjects:	Algorithm design and analysis Applied sciences Classification algorithms Clustering algorithms Electric, optical and optoelectronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Flip chip solder joints Frequency Image processing Information, signal and communications theory Inspection Neural networks Pattern recognition Performance analysis Signal processing Telecommunications and information theory Testing, measurement, noise and reliability Ultrasonic imaging
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creator	Sheng Liu Ume, I.C. Achari, A.
description	A defects pattern recognition system has been developed for the flip-chip solder joint quality inspection by using laser ultrasound and interferometric techniques. This system extracts error ratio and dominant frequency as features from ultrasound waveforms. It also performs a cluster analysis of those feature vectors by applying probabilistic neural network classification algorithm. The system can automatically classify chips into different clusters and can, therefore, find differences between good and bad chips, as well as classifying the type of defect.
doi_str_mv	10.1109/TEPM.2004.830515
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Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Flip chip solder joints</topic><topic>Frequency</topic><topic>Image processing</topic><topic>Information, signal and communications theory</topic><topic>Inspection</topic><topic>Neural networks</topic><topic>Pattern recognition</topic><topic>Performance analysis</topic><topic>Signal processing</topic><topic>Telecommunications and information theory</topic><topic>Testing, measurement, noise and reliability</topic><topic>Ultrasonic imaging</topic><toplevel>online_resources</toplevel><creatorcontrib>Sheng Liu</creatorcontrib><creatorcontrib>Ume, I.C.</creatorcontrib><creatorcontrib>Achari, A.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) Online</collection><collection>IEEE Xplore</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><collection>Biotechnology Research Abstracts</collection><collection>Biotechnology and BioEngineering Abstracts</collection><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sheng Liu</au><au>Ume, I.C.</au><au>Achari, A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Defects pattern recognition for flip-chip solder joint quality inspection with laser ultrasound and Interferometer</atitle><jtitle>IEEE transactions on electronics packaging manufacturing</jtitle><stitle>TEPM</stitle><date>2004-01</date><risdate>2004</risdate><volume>27</volume><issue>1</issue><spage>59</spage><epage>66</epage><pages>59-66</pages><issn>1521-334X</issn><eissn>1558-0822</eissn><coden>ITEPFL</coden><abstract>A defects pattern recognition system has been developed for the flip-chip solder joint quality inspection by using laser ultrasound and interferometric techniques. 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source	IEEE Electronic Library (IEL) Journals
subjects	Algorithm design and analysis Applied sciences Classification algorithms Clustering algorithms Electric, optical and optoelectronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Flip chip solder joints Frequency Image processing Information, signal and communications theory Inspection Neural networks Pattern recognition Performance analysis Signal processing Telecommunications and information theory Testing, measurement, noise and reliability Ultrasonic imaging
title	Defects pattern recognition for flip-chip solder joint quality inspection with laser ultrasound and Interferometer
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