A Physics-Based Causal Bond-Wire Model for RF Applications

• Published in: IEEE transactions on microwave theory and techniques 2012-12, Vol.60 (12), p.3683-3692
• Main Authors: Nazarian, A. L., Tiemeijer, L. F., John, D. L., van Steenwijk, J. A., de Langen, M., Pijper, R. M. T.
• Format: Article
• Language: English
• Subjects: Applied sciences; Approximation methods; Bond wire; Capacitance; compact model; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Impedance; Inductance; Integrated circuit modeling; mutual inductance; resistance; self inductance; Wires
• ISSN: 0018-9480; 1557-9670
• DOI: 10.1109/TMTT.2012.2217983

A predictive causal physics-based compact model that describes the electrical behavior of multiple bond wires as a function of signal frequency and geometry of the wires is presented. It takes into account the inductive coupling between the wires, the frequency-dependent losses, and the capacitance between the wires and the ground plane. The model does not require any fitting parameters and places no restriction on the shape of the bond wires. Model predictions of resistance, of capacitance to the ground plane, and of self and mutual inductances of bond wires with different shapes were compared to the corresponding measured quantities. All inductive calculations use closed formulas that give a better approximations than the state-of-the-art. Furthermore, the causal nature of this model implies that it may be used for time-domain simulations.