A W-Band Low-Loss Planar MMICs to RWG Transition Using Copper Additive Manufacturing and Its 1-D Phased Array Antenna-in-Package Application

• Published in: IEEE transactions on microwave theory and techniques 2024-10, p.1-11
• Main Authors: Wang, Ding, Li, Cheng Jia, Fan, Yong, Cheng, Yu Jian
• Format: Article
• Language: English
• Subjects: Antenna-in-package (AiP); Bandwidth; Bonding; Copper; copper additive manufacturing (AM); Gold; Integrated circuit modeling; Linear antenna arrays; Phased arrays; Radio frequency; rectangular microcoaxial line (R<inline-formula xmlns:ali="http://www.niso.org/schemas/ali/1.0/" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"> <tex-math notation="LaTeX"> mu</tex-math> </inline-formula>CL); RF packaging; Slot antennas; W-band transition; Wire; wire-bond
• ISSN: 0018-9480; 1557-9670
• DOI: 10.1109/TMTT.2024.3472225

This article introduces a novel integration approach for W -band 1-D scanning phased array systems, focusing on efficient transition structures and antenna integration. Utilizing copper additive manufacturing (AM) technology, the proposed transitions exhibit low loss and compact size, enabling the seamless integration of ridge waveguide (RWG) slot antennas with RF MMICs. The W -band transition offers a wide impedance bandwidth ranging from 85 to 105 GHz, with a reflection coefficient below - 13 dB and an insertion loss (IL) of less than 0.3 dB. At 94 GHz, the transversal profile of the antenna is 0.45 \lambda_{0} , facilitating 1-D scanning up to \pm 60 ^{\circ} and enhancing its suitability for W -band 1-D phased array applications. With a transition structure size of merely 1.4 \times 3.43 mm ^{2} , this approach demonstrates substantial potential for W -band RF front-end integration.