Characterizing Interconnects to 325 GHz

We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line (mTRL) calibration and subsequently de-embeds the interconnect with a multitiered calibration. We experimentally validated our method to 325 GHz with distr...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2024-11, p.1-6
Main Authors: Jungwirth, Nicholas R., Bosworth, Bryan T., Papac, Meagan C., Hagerstrom, Aaron M., Marksz, Eric J., Cheron, Jerome, Bergmann, Florian, Stelson, Angela C., Feldman, Ari, Williams, Dylan F., Long, Christian J., Orloff, Nathan D.
Format: Article
Language:English
Subjects:
Broadside-coupled coplanar waveguide (CPW)
de-embedding
distributed circuit model
heterogeneous interconnect
multiline thru-reflect-line (mTRL)
on-wafer calibration
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Summary:We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line (mTRL) calibration and subsequently de-embeds the interconnect with a multitiered calibration. We experimentally validated our method to 325 GHz with distributed contactless interconnects in the form of broadside coupled coplanar waveguides (CPWs) as a test case. We find excellent agreement between experimental, full-wave simulations, and a distributed model of contactless interconnects. This work provides a general method to accurately characterize interconnects and to translate measurement reference planes beyond interconnect boundaries when one or more interconnect ports are not directly accessible.
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2024.3496657