Thin-Film Deposition With Refractory Materials Using a Vacuum Arc

Refractory metal plasma generated by a vacuum arc was used to deposit thin films with different arc currents I. The deposition rate Vdep was measured for electrode configurations including a planar Zr cathode and a planar W anode; cylindrical W or Mo electrode pairs and a cylindrical Nb cathode clos...

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Bibliographic Details
Published in:IEEE transactions on plasma science 2015-08, Vol.43 (8), p.2323-2328
Main Authors: Beilis, Isak I., Koulik, Yosef, Yankelevich, Yefim, Arbilly, David, Boxman, Raymond L.
Format: Article
Language:English
Subjects:
Anodes
Cathodes
Coatings
Electrodes
Metallic plasma
Niobium
Plasma physics
Plasmas
refractory electrode
thin film
Thin films
vacuum arc
Vacuum arcs
Vacuum technology
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Summary:Refractory metal plasma generated by a vacuum arc was used to deposit thin films with different arc currents I. The deposition rate Vdep was measured for electrode configurations including a planar Zr cathode and a planar W anode; cylindrical W or Mo electrode pairs and a cylindrical Nb cathode closed by a BN plate and a W or Nb shower-head cup anode or with one-hole Ta cup anode. Vdep for a Mo electrode pair with I = 275 A at a distance L = 110 mm from the electrode axis reached 2.2 μm/min, 60 s after arc ignition. For the W electrode pair Vdep was ~1 μm/min at 80 s (I = 200 A and L = 110 mm), while for W film deposition with shower-head anode Vdep was ~0.6 μm/min (I = 200 A and L = 60 mm). For Nb films deposited with the closed electrode configuration, Vdep was 0.3 μm/min at 30 s after arc ignition (I = 275 A and L = 80 mm from the anode front).
ISSN:0093-3813
1939-9375
DOI:10.1109/TPS.2015.2432577