Improved Yield Through Use of a Scalable Parametric Measurement Macro

Incorporating a scalable parametric measurement (SPM) macro in semiconductor products enables N to P ratio screening at wafer test where each die can be tested. While in line scribe line measurements provide valuable feedback to correct manufacturing problems, in line test sample sizes and the need...

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Bibliographic Details
Published in:IEEE transactions on semiconductor manufacturing 2011-05, Vol.24 (2), p.190-196
Main Authors: Bickford, Jeanne Paulette, Habib, Nazmul, Goss, John R, Bickford, Rebecca A
Format: Article
Language:English
Subjects:
Applied sciences
Current measurement
Design for manufacture
Design. Technologies. Operation analysis. Testing
Electronics
Escape systems
Exact sciences and technology
Feedback
Integrated circuits
Loss measurement
Manuals
Manufacturing
Metals
Microelectronic fabrication (materials and surfaces technology)
Modules
Packages
Screening
Screens
semiconductor device manufacture
Semiconductor device measurement
semiconductor device testing
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductors
Testing, measurement, noise and reliability
Voltage measurement
Wafers
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Description
Summary:Incorporating a scalable parametric measurement (SPM) macro in semiconductor products enables N to P ratio screening at wafer test where each die can be tested. While in line scribe line measurements provide valuable feedback to correct manufacturing problems, in line test sample sizes and the need to disposition entire wafers limit the usefulness of this technique as a product screen. Functional patterns applied at module test provide a measure of protection against escapes to system level, but module yield loss results in higher cost than wafer yield loss because of the added loss of package and module test costs. Use of a SPM macro for N to P ratio disposition maximizes yield and minimizes false rejects and false accepts.
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2011.2116127