Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic found...

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Published in:Journal of electronic packaging 1995-06, Vol.117 (2), p.136-140
Main Authors: Engel, Peter A., Chou, Shou-Chien
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Language:English
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creator Engel, Peter A.
Chou, Shou-Chien
description In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic foundation modulus function. For the thermal mismatch loading, the total temperature range ΔT (e.g., 0–100°C) is divided into a finite number n of temperature stages, and the final responses are superposed from the n contributions each of which done using an isothermal stress calculation. Three solders (Sn-Pb solders 63/37, 70/30, and 10/90), were investigated; the solder barrel thickness and mismatch temperature range were also variable parameters. Comparisons with elastic solder foundation calculation results show that thermal and inelastic solder stress/strain dependence should be included especially in the higher (over 75°C) temperature range.
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Electron. Packag</addtitle><description>In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic foundation modulus function. For the thermal mismatch loading, the total temperature range ΔT (e.g., 0–100°C) is divided into a finite number n of temperature stages, and the final responses are superposed from the n contributions each of which done using an isothermal stress calculation. Three solders (Sn-Pb solders 63/37, 70/30, and 10/90), were investigated; the solder barrel thickness and mismatch temperature range were also variable parameters. 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Electron. Packag</stitle><date>1995-06-01</date><risdate>1995</risdate><volume>117</volume><issue>2</issue><spage>136</spage><epage>140</epage><pages>136-140</pages><issn>1043-7398</issn><eissn>1528-9044</eissn><abstract>In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent stress-strain curve of solder, without creep, is taken into account, yielding an elasto-plastic foundation modulus function. For the thermal mismatch loading, the total temperature range ΔT (e.g., 0–100°C) is divided into a finite number n of temperature stages, and the final responses are superposed from the n contributions each of which done using an isothermal stress calculation. Three solders (Sn-Pb solders 63/37, 70/30, and 10/90), were investigated; the solder barrel thickness and mismatch temperature range were also variable parameters. Comparisons with elastic solder foundation calculation results show that thermal and inelastic solder stress/strain dependence should be included especially in the higher (over 75°C) temperature range.</abstract><pub>ASME</pub><doi>10.1115/1.2792080</doi><tpages>5</tpages></addata></record>
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title Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress
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