Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application

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Bibliographic Details
Published in:Journal of electronic packaging 1997-06, Vol.119 (2), p.144-145
Main Authors: Pecht, Michael G, Nguyen, Luu T, Hakim, Edward B, Rafanelli, Anthony J
Format: Article
Language:English
Online Access:Get full text
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ISSN:1043-7398
1528-9044
DOI:10.1115/1.2792221