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Special Issue on Mechanics of Surface Mount Assemblies

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Bibliographic Details
Published in:	Journal of electronic packaging 1993-06, Vol.115 (2), p.139-140
Main Authors:	Barker, Donald, Conrad, Hans, Engel, Peter, Hsu, Tai-Ran, Lau, John, Pao, Yi-Hsin, Rafanelli, Anthony, Solomon, Harvey, Stone, Donald, Wu, Frank
Format:	Article
Language:	English
Citations:	Items that cite this one
Online Access:	Get full text
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