Ceramic Materials for Electronic Packaging

The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in...

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Bibliographic Details
Published in:Journal of electronic packaging 1989-09, Vol.111 (3), p.183-191
Main Author: Rabinovich, E. M
Format: Article
Language:English
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Summary:The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.
ISSN:1043-7398
1528-9044
DOI:10.1115/1.3226532