Finite Element Modeling for Optimizing Hermetic Package Reliability

The thermal stresses in microwave packages are studied by the finite element method. Emphasis is placed on the effects of material construction and design on the reliability of very small hermetic packages. Three different microwave packages have been designed and six finite element models (two for...

Full description

Saved in:
Bibliographic Details
Published in:Journal of electronic packaging 1989-12, Vol.111 (4), p.255-260
Main Authors: Lau, J. H, Lian-Mueller, L. B
Format: Article
Language:English
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The thermal stresses in microwave packages are studied by the finite element method. Emphasis is placed on the effects of material construction and design on the reliability of very small hermetic packages. Three different microwave packages have been designed and six finite element models (two for each design) have been analyzed. To verify the validity of the finite element results, some leak tests have been performed and the results agree with the analytical conclusions. The results presented herein should provide a better understanding of the thermal behavior of hermetic packages and should be useful for their optimal design.
ISSN:1043-7398
1528-9044
DOI:10.1115/1.3226544