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Gratings of regular arrays and trim exposures for ultralarge scale integrated circuit phase-shift lithography

Current semiconductor technology requires optical lithography to image feature sizes smaller than the exposure tool wavelength. In order to achieve this subwavelength imaging, some form of optical resolution-enhancement technology is required, with phase-shift methods offering the greatest potential...

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Bibliographic Details
Published in:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2001-11, Vol.19 (6), p.2366-2370
Main Authors: Fritze, M., Tyrrell, B., Astolfi, D., Yost, D., Davis, P., Wheeler, B., Mallen, R., Jarmolowicz, J., Cann, S., Chan, D., Rhyins, P., Carney, C., Ferri, J., Blachowicz, B. A.
Format: Article
Language:English
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Summary:Current semiconductor technology requires optical lithography to image feature sizes smaller than the exposure tool wavelength. In order to achieve this subwavelength imaging, some form of optical resolution-enhancement technology is required, with phase-shift methods offering the greatest potential enhancement. Major impediments to the wide-scale adoption of this technology have included mask cost, inspectability/repair, and turnaround time. The correction of optical proximity effects, which are typically large in phase-shift techniques, have also been an important issue. In this work, we propose a new type of phase-shift approach utilizing gratings of regular arrays and trim exposures. This method makes use of multiple-exposure phase-shift imaging of dense-only features. Proximity effects can be nearly eliminated along with the complex optical proximity corrections typically required on the mask. The simple phase-shift masters can also be reused for multiple designs, thereby addressing cost and turnaround time issues.
ISSN:0734-211X
1071-1023
1520-8567
DOI:10.1116/1.1408950