Submicron thermocouple measurements of electron-beam resist heating

Pattern distortion caused by resist heating is believed to contribute significantly to errors in feature size and pattern placement. A number of models have been proposed to predict the temperature rise of resist heating but experimental results are scarce. We fabricated and calibrated thin film gol...

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Bibliographic Details
Published in:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2002-11, Vol.20 (6), p.3044-3046
Main Authors: Chu, Dachen, Bilir, D. Taner, Pease, R. Fabian W., Goodson, Kenneth E.
Format: Article
Language:English
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Summary:Pattern distortion caused by resist heating is believed to contribute significantly to errors in feature size and pattern placement. A number of models have been proposed to predict the temperature rise of resist heating but experimental results are scarce. We fabricated and calibrated thin film gold/nickel thermocouples with (400  nm ) 2 junction size and used these to measure work-piece heating during electron-beam exposure. Irradiation by a 15 kV electron beam of 600 nA and 2 μm radius caused a temperature rise of 70 K, about 15% lower than the calculated result. The discrepancy may be due to the differences between the energy deposition profiles used in modeling and those prevailing in the experiments.
ISSN:0734-211X
1071-1023
1520-8567
DOI:10.1116/1.1523023