Growth of aluminum nitride films by plasma-enhanced atomic layer deposition

Aluminum nitride films have been grown by plasma-enhanced atomic layer deposition under self-limiting growth and CVD-like conditions. The films have been characterized by IR spectroscopy, ellipsometry, and Auger exposure spectroscopy. We have examined the influence of the deposition temperature, the...

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Bibliographic Details
Published in:Inorganic materials 2015-07, Vol.51 (7), p.728-735
Main Authors: Tarala, V. A., Altakhov, A. S., Shevchenko, M. Yu, Valyukhov, D. P., Lisitsyn, S. V., Martens, V. Ya
Format: Article
Language:English
Subjects:
Chemistry
Chemistry and Materials Science
Industrial Chemistry/Chemical Engineering
Inorganic Chemistry
Materials Science
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Summary:Aluminum nitride films have been grown by plasma-enhanced atomic layer deposition under self-limiting growth and CVD-like conditions. The films have been characterized by IR spectroscopy, ellipsometry, and Auger exposure spectroscopy. We have examined the influence of the deposition temperature, the reactor purge time after exposure to trimethylaluminum vapor, and the plasma exposure time on the growth rate and composition of the films. Under the deposition conditions studied, the growth rate ranged from 0.1 to 0.26 nm per cycle and the refractive index of the films was 1.52 to 1.98. We obtained films with an aluminum to nitrogen atomic ratio near unity.
ISSN:0020-1685
1608-3172
DOI:10.1134/S0020168515070158